1 / 5 www.asb.co.kr february 2008 p lerow tm apm0942 - p29 high oip3 medium power ampl i fier module parameter unit specifications min typ max frequency range mhz 925 960 gain db 30 31 gain flatness db ? 0.4 ? 0.5 noise figure db 6.6 6.8 output ip3 (1) dbm 44 47 s11 / s22 (2) db - 14 / - 9 output p1db dbm 28 29 switching time (3) ? sec - supply current ma 370 400 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of 12 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switc hing dc voltage from 0 v to v s . pin number function 2 rf in 5 rf out 6 v s other s ground feature s c o u pl er note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we r ecommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. c o u pl er c o u pl er c o u pl er c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 1 - stage single type s 21 = 31.4 db @ 925 mhz = 30.6 db @ 960 mhz nf of 6.6 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current description s 21 = 31.4 db @ 925 mhz = 30.6 db @ 960 mhz nf of 6.6 db over fr e quency unconditionall y stable single 5v supply high oip3 @ low current typ. @ t = 25 ? c, v s = 5 v, freq. = 942.5 mhz, z o.sys = 50 ohm specifications (in pr o duction) apm0942 - p29 asb inc. (top view) solder stencil area ? 0.3 plated thru holes to ground plane (side view) 2 x ? 2.0 plated thru holes to scr ew on heat sinker (recommended footprint) (bottom view) plerow ou t line drawing (unit: mm) the plerow tm apm - series is an internally matched amplifier mini - module for such application band in smd package with the output p1db of 29 dbm. it is compactly designed for low current consumption and high oip3. integrating all the components for biasing and matching within the module enhances production yield and throughput as well. it passes through the stringent dc, rf, and reliability tests. not sa mple test but 100% quality control test is made before packing.
2 / 5 www.asb.co.kr february 2008 p lerow tm apm0942 - p29 high oip3 medium power ampl i fier module s - param e ters oip3 p1db 925~960 mhz +5 v stability fa c tor (k) typical performance (measured) noise figure
3 / 5 www.asb.co.kr february 2008 p lerow tm apm0942 - p29 high oip3 medium power ampl i fier module output channel power (@ aclr= - 45dbc, +/ - 5mhz of f set) ** test source : agilent e4433b (3gpp w - cdma test model - 1 64dpch) oip3 vs output power (@ 1mhz offset, 1 - tone power) aclr vs channe l power
4 / 5 www.asb.co.kr february 2008 p lerow tm apm0942 - p29 high oip3 medium power ampl i fier module 1) the tantal or mlc (multi laye r ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly t o the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are in clu d- ed inside the apm module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) + - apm out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor in out vs evaluation board layout size 40x40mm (for apm series C 10x10mm)
5 / 5 www.asb.co.kr february 2008 p lerow tm apm0942 - p29 high oip3 medium power ampl i fier module channel power vs. aclr test configuration apm0942 C p29 evaluation board attached with heat sink evaluation board * in order to prevent damage of d.u.t (apm - series) f rom heating, you must to use a properly sized heat sink for testing a module.
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